Three-dimensional Microscopic Contact Model for DEM Analyses of Bonded Assembly

Jiang Mingjing,Shen Zhifu

Chinese Journal of Underground Space and Engineering ›› 2016, Vol. 12 ›› Issue (1) : 30-37.

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Chinese Journal of Underground Space and Engineering ›› 2016, Vol. 12 ›› Issue (1) : 30-37.

Three-dimensional Microscopic Contact Model for DEM Analyses of Bonded Assembly

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2016, 12(1): 30-37

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